SOLDER FLUX SSRMA-229 TPF(UV)

1 . Imported lead-free materials, perfect formula, high quality.

 2 . Make of the newest rosin and other imported high-quality materials.

 3 .  Embellish tin fast, low smoke, less residue and surface with low insulation resistance.

 4 . Widely used in mobile phones, computers, graphics cards, projectors and electronic products. For welding and rework BGA, CSP and BGA chip, especially for high-class mobile phones, have a good run of tin and solderability.

 5 . Package contains one pusher, more convenient to use.